Img
|
Part Number |
Manufacturers
|
Desc
|
In Stock
|
Packing
|
Rfq |
|||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
391 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
|
991 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/OMin 1.14V VMax 1.26V V
|
795 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
980 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
|
794 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S025T System On ChipSmartFusion?2 Series 207 I/O
|
738 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
|
261 |
256-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S025T System On ChipSmartFusion?2 Series 267 I/O
|
463 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
|
937 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
808 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
|
525 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/OMin 1.14V VMax 1.26V V
|
159 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
|
417 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
128 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 200 I/O1.2V
|
445 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 484 Pin M2S025 System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
|
548 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
748 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
632 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/O
|
281 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
413 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
696 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
|
762 |
256-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
549 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S005 System On ChipSmartFusion?2 Series 209 I/O
|
370 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
996 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O
|
996 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
333 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
|
379 |
325-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S025T System On ChipSmartFusion?2 Series 267 I/O
|
944 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
|
432 |
484-BGA |
|
|||||||||||||||||||||||||