Img
|
Part Number |
Manufacturers
|
Desc
|
In Stock
|
Packing
|
Rfq |
|||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O
|
488 |
896-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
288 Terminations-40°C~100°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 28, FPGA - 68 I/O1.5V Min 1.425V VMax 1.575V V
|
804 |
288-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V
|
340 |
208-BFQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V
|
532 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V
|
286 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 28, FPGA - 68 I/O
|
634 |
288-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 288 Pin A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/OMin 1.425V VMax 1.575V V
|
921 |
288-TFBGA, CSPBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S010S System On ChipSmartFusion?2 Series 195 I/O
|
311 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S100T System On ChipSmartFusion?2 Series 574 I/O1.2V
|
724 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ M2S150S System On ChipSmartFusion?2 Series 574 I/O
|
617 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ M2S150S System On ChipSmartFusion?2 Series 574 I/O
|
813 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O
|
315 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
|
917 |
144-LQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ M2S100T System On ChipSmartFusion?2 Series 574 I/O1.2V
|
395 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
|
563 |
144-LQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
|
417 |
144-LQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O
|
162 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O
|
580 |
144-LQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V
|
101 |
256-LBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O
|
867 |
676-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ 484 Pin M2S050S System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
|
995 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ M2S090S System On ChipSmartFusion?2 Series 267 I/O
|
292 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O
|
641 |
144-LQFP |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V
|
636 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V
|
281 |
1152-BBGA, FCBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 267 I/O
|
601 |
484-BGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
774 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
723 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
471 |
400-LFBGA |
|
|||||||||||||||||||||||||
Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
|
911 |
400-LFBGA |
|
|||||||||||||||||||||||||